Interesting! Is this just due to the normal variations of mass production?
I get it about adding the triple-channel DIMMs in sets of three, and I understand how multi-channel RAM access works better than the old single-channel design, but I missed why 3 x 2Gb is better than 6 x 1Gb. Sorry.
Thanks! 
If you look at memory sets, some manufactures state "matched pairs" or "tested pairs". The reason they do this is so that the memory run at the very close specs together. There is an amount of tolerance that is allowed between mated pairs for them to be pairs, more then the allowed amount and they will not sync together well and not be matched pairs.
At posted stock speed they should run fine together, but setting the QPI (i7s) higher the sticks may not agree and sync up causing BSD because of memory failure. This could also happen at stock speeds without any overclocking when using unmatched pairs, is it common for this to happen, no but it does happen. You also have a higher chance of getting a bad stick. Your adding variables buy doubling the number of sticks. The more DIMMs you use the better the chance if one fails not being able to locate the bad stick without running Memtest on each stick for 2 hours. You could place the sticks in one by one and still have the system boot, but in combination there is a failure.
Smaller DIMMs have faster timings but with DDR3 Dual or Triple Channel they timings are not all that great anyhow but the speed compensates for the higher timings. Hope this helps