Intel recently announced it has developed a new way to package processors (
http://www.intel.com/pressroom/archive/releases/20011008tech.htm ).
The pic off to the side shows a chip packaged with the new process. Basically, it is similar to how the processor itself is built, but on a much larger scale. It allows the interconnects to be much shorter and smaller in size. It also means that the entire package (without pins) is less than 1mm tall. You will no longer be able to see the processor because the package will be built around and over it.
The main roadblock right now is that it is an entirely different packaging technology. To impliment it, factories would have to be closed and retooled, or closed and replaced with factories elsewhere. Intel is not about to do this right now. I think they made the announcement in hopes that someone else would.
The pic shows the new packaging (cut in half) with a dime on top of it (old Mercury head dime).
AKDejaVu
