I found the Asus Maximus VI Hero in stock finally Friday afternoon, got it and a 4770k ordered up.
The early results on Haswell is that Intel really cheaped out on the thermal compound between the CPU die and the heat spreader. Possibly even worse than for Ivy Bridge. De-lidding is necessary for most people to reach beyond 4.2 GHz, even with water cooling. So I'll probably go stock for a day, OC for a couple weeks, then delid a CPU for the first time ever. Should be... interesting.
Interesting...
I read here that the problem is not the thermal paste, but rather the adhesive that secures the lid. To account for manufacturing tolerances, Intel uses a bit too much adhesive, which places the lid a bit too far away from the actual chip, which in turn requires a layer of thermal paste that is a bit too thick. Confirmed, plausible, or busted?
Anyway, over the weekend I ordered a 4770K, an ASUS Z87-Pro mobo, and a Corsair H80i all-in-one water cooling unit. All hands, brace for impact!